TECHNICAL STANDARD DESIGN RULES

Design Rules for Standard Ultra Thin Flexible Microcircuits Manufacturing Process

01. Typical Standard Multilayer Flexible Microcircuits
02. Ultra Thin Flexible Multilayer Flexible Microcircuits
03. Flexible Microcircuits Capabilities
04. Layout Data Formats
05. Thin Film Hybrid Metalization
06. Ultra Thin Flexible Multilayer Flexible Microcircuits
07. High Density Interconnection Flexible Microcircuits with Microvias
08. High Density Interconnection Microcircuits on ultra thin or thick GLASS & CERAMICS
09. Polyimide Specification
10. All Substrates & Exotics Substrates Materials
11. Properties & Dimensions
12. Conductor Metal layers
13. Substrates & Dimension
14. Smart Slim Flex & Foldable Devices Specifications
15. High Density Interconnection & Hybrid Microcircuits
16. HDI Flexible Microcircuits Bending & Folding
17. Traces, Spaces & Vias Specification for Flexible Microcircuits
18. Ground, Power, Shield Layers Specification
19. HDI Flexible Pads & Microvias Design Rules
20. Traces, Spaces & Microvias Specification for Ceramics
21. Microvias & Poyimide Pads Openings
22. Polyimide Multilayers Design & Manufacturing Configurations
23. Thick Film Metalization on Glass & Ceramics